Quote
A. Kandziora, B. Wittig, G. Asseburg, and M. Thoben, "Boundary Conditions for Reproducible and Comparable Condensation Tests to Prove the Migration Resistance of Assemblies," in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 2024, pp. 1-4.
Content
In the automotive industry the long-term robustness of electronic assemblies under harsh ambient conditions is proven by various international, national and company-specific standards as part of the approvals. The applied tests simulate condensing ambient conditions in a time-lapsed manner and are usually carried out in climate chambers. Occasional differences of opinion between suppliers and OEMs on the correct interpretation of these time-lapsed environmental simulations as well as misunderstood influences on the test results motivated the Volkswagen Laboratory for Materials Technology to investigate these questions in principle.
References
DOI 10.1109/ESTC60143.2024.10712124